| PART |
Description |
Maker |
| 21-0109B |
PACKAGE OUTLINE, 10L uMAX, EXPOSED PAD
|
Maxim Integrated Products, Inc.
MAXIM - Dallas Semiconductor
|
| SOT353 U-DFN3030-12 U-DFN3030-8 U-DFN3030-10 U-DFN |
SUGGESTED PAD LAYOUT
SUGGESTED PAD LAYOUT
|
Diodes Incorporated
http://
|
| 8SOIC |
8 PIN SOIC PACKAGE OUTLINE
8 PIN SOIC PACKAGE OUTLINE
|
SMSC[SMSC Corporation]
|
| IL3X-HX5F12.5-32.768 |
2 Pad Ceramic Package, 1.5 mm x 3.2 mm
|
ILSI America LLC
|
| ILCX05-BB0318-20.000 ILCX05-BB1318-20.000 ILCX05-B |
4 Pad Ceramic Package, 5.5 mm x 11.9 mm
|
ILSI America LLC
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| ILCX09-GI1F18-20.000 ILCX09-HF3F18-20.000 ILCX09-B |
2 Pad Ceramic Package Quartz Crystal, 3.5 mm x 6 mm
|
ILSI America LLC
|
| IL3M-HX5F12.5-32.768 |
4 Pad Plastic Package Quartz Crystal, 3.8 mm x 8 mm
|
ILSI America LLC
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| WLCSP3X3-9 |
Package Outline
|
Global Mixed-mode Techn...
|
